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Video Testimonials

2009

 

 

 

Alain Astier
Group Vice president
Front End Technology & Manufacturing
STMicroelectronics N.V

 

 

 

Dr Gopalan Rajeswaran
Group Chief Technical Officer & CEO/Strategic Technologies
Moser Baer Photovoltaic Ltd

 

 

 

 

Johan Willem Oosterlee
Vice President, purchasing
austriamicrosystems AG

 

 

 

 

John Bahng
Director Asia / CEO USA
Test Equipment Connection Corp

 

 

 

 

Paul Farrar
Vice President
Semiconductor Process Development, IBM

 

 

 
 

Thomas Oppert
Vice President Global Sales & Marketing
Pac Tech Packaging Technologies GmbH

 

 

 
2008
     

 

 Choon Heung Lee
SVP
Amkor

 

 

 

To be confirmed

 

Michael Garner
Program Manager: External Materials
Research Intel

 

 

 

 

John Heugle
CEO
Austria Microsystems

 

 

 

 

Bill Adamec
Senior Director Xbox
Microsoft

 

 

 

 

Paul Kempf
VP Silicon
RIM

 

 

 

 

Mike Hadsell
Executive Vice President,
Worldwide Sales and Marketing
Toppan

 

 

 

 

Wen Sen Pan
VP
Macronix



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Buyers


Johan Willem Oosterlee
Vice President Purchasing
Austriamicrosystems AG

Elizabeth Williamson
Director,
300mm Semiconductor Operations
IBM

Marco Mora,
Chief Operating Officer,
SMIC

Peter Rickert,
TI Fellow,
Platform Director,
Texas Instruments



Choon-sik Oh
Chief Operating
Officer
Hynix Semiconductor

Shelton Lu
 VP Manufacturing & Product Engineering
VIA Technologies 		   

Suppliers


Glenn Gale
PhD
Vice President,
FEOL Cleaning
SEZ Group

Michael Christopher Lamarra
Marketing Manager
Greene, Tweed & Co

Hiroyuki Funamoto,
CEO;
Kiyoshi Watanabe,
GM of SIB Sales and Marketing,
SII NanoTechnology Inc.

Stan Yarbro,
EVP Sales,
Varian Semiconductor Equipment Associates,
Inc.


Leo Berlinghieri,
President and Chief Operating Officer,
MKS Instruments,
Inc.

Michael Hadsell,
VP and Managing Director,
Asia-Pacific,
DuPont Photomasks,
Inc.		    

 
   
 

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